Hotline：0755-2370085
| Project | Entry name | Process capability |
| Overall process capability | Number of layers | 1st to 30th floors |
| High frequency mixed voltage HDI | Ceramic materials and PTFE materials can only be mechanically drilled for blind burying, depth control drilling, back drilling, etc. (laser drilling is not allowed, and copper foil cannot be directly pressed) | |
| High speed HDI | Made according to conventional HDI | |
| Laser order | 1-5 levels (≥ 6 levels need to be reviewed) | |
| Plate thickness range | 0.1-5.0mm (less than 0.2mm, more than 6.5mm shall be reviewed) | |
| Minimum finished product size | Single board 5 * 5mm (less than 3mm needs to be reviewed) | |
| Maximum finished product size | 2-20 floors 21 * 33inch; Remarks: If the short edge of the plate exceeds 21inch, it shall be reviewed. | |
| Maximum finished copper thickness | Outer layer 8OZ (more than 8OZ needs to be reviewed), inner layer 6OZ (more than 6OZ needs to be reviewed) | |
| Minimum finished copper thickness | 1/2oz | |
| Alignment between layers | ≤3mil | |
| Through hole filling range | Plate thickness ≤ 0.6mm, aperture ≤ 0.2mm | |
| Thickness range of resin plug hole plate | 0.254-6.0mm, PTFE plate resin plug hole needs to be reviewed | |
| Plate thickness tolerance | Plate thickness ≤ 1.0mm; ±0.1mm | |
| Plate thickness ＞ 1.0mm; ±10% | ||
| Impedance tolerance | ±5Ω（＜50Ω），±10%（≥50Ω）； ± 8% (≥ 50 Ω, to be reviewed) | |
| Warpage | Normal: 0.75%, limit: 0.5% (to be reviewed), maximum: 2.0% | |
| Pressing times | Pressing of the same core plate ≤ 5 times (more than 3 times need to be reviewed) | |
| Material type | Common Tg FR4 | Shengyi S1141, Jiantao KB6160A, Guoji GF212 |
| Medium Tg FR4 | Shengyi S1150G (medium Tg plate), Jiantao KB6165F, Jiantao KB6165G (halogen-free) | |
| High Tg FR4 | Shengyi S1165 (halogen-free), Jiantao KB6167G (halogen-free), Jiantao KB6167F | |
| Aluminum substrate | Guoji GL12, Clear CS-AL-88/89 AD2, Juqin JQ-143 mixed compaction FR-4 of layer 1-8 | |
| Type of material used for HDI board | LDPP (IT-180A 1037 and 1086), common 106 and 1080 | |
| High CTI | Shengyi S1600 | |
| High Tg FR4 |
Isola：FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR； Lianmao: IT-180A IT-150DA； Nelco：N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI； Panasonic: R-5775K (Megtron 6), R-5725 (Megtron 4); Jiantao: KB6167F; Platform light: EM-827; Hongren: GA-170; South Asia: NP-180; Taiyao: TU-752, TU-662; Hitachi: MCL-BE-67G (H), MCL-E-679 (W), MCL-E-679F (J); Tenghui: VT-47; |
|
| High frequency materials filled with ceramic powder | Rogers：Rogers4350、Rogers4003; Arlon:25FR、25N; | |
| PTFE high-frequency material | Rogers Series, Taconic Series, Arlon Series, Nelco Series, TP Series | |
| PTFE prepreg | Taconic: TP series, TPN series, HT1.5 (1.5mil), Fastrise series | |
| Material mixing | Rogers, Taconic, Arlon, Nelco and FR-4 | |
| Metal substrate | Number of layers | Aluminum substrate and copper substrate: 1-8 layers; Cold plate, sintered plate and embedded metal plate: 2-24 layers; Ceramic plate: 1-2 layers; |
| Finished product size (aluminum substrate, copper substrate, cold plate, sintered plate, embedded metal plate) | MAX:610*610mm、MIN:5*5mm | |
| Maximum production size (ceramic plate) | 100*100mm | |
| Finished plate thickness | 0.5-5.0mm | |
| Copper thickness | 0.5-10 OZ | |
| Metal base thickness | 0.5-4.5mm | |
| Metal base material | AL：1100/1050/2124/5052/6061； Copper: red copper and pure iron | |
| Minimum finished hole diameter and tolerance | NPTH：0.5±0.05mm； PTH (aluminum substrate, copper substrate): 0.3 ± 0.1mm; PTH (cold plate, sintered plate, embedded metal plate): 0.2 ± 0.10mm; | |
| Profile machining accuracy | ±0.2mm | |
| Surface treatment process of PCB part | Lead/lead-free tin spraying; OSP； Nickel (palladium) gold precipitation; Electric (nickel) soft/hard gold; Electrotinning; Nickel free electroplating of hard and soft gold; Made of thick gold | |
| Metal surface treatment | Copper: nickel plated gold; Aluminum: anodizing, hard oxidation, chemical passivation; Mechanical treatment: dry sand blasting and wire drawing | |
| Metal based materials | Full aluminum substrate (T-110, T-111); Tenghui aluminum substrate (VT-4A1, VT-4A2, VT-4A3); Laird aluminum base plate (1KA04, 1KA06); Beggs metal substrate (MP06503, HT04503); TACONIC metal substrate (TLY-5, TLY-5F); | |
| Thickness of thermal conductive adhesive (medium layer) | 75-150um | |
| Size of embedded copper block | 3*3mm—70*80mm | |
| Flatness of buried copper block (drop accuracy) | ±40um | |
| Distance from embedded copper block to hole wall | ≥12mil | |
| thermal conductivity | 0.3-3W/m.k (aluminum substrate, copper substrate, cold plate); 8.33W/m.k (sintered plate); 0.35-30W/m.k (buried metal plate); 24-180W/m.k (ceramic plate); | |
| product type | Rigid plate | Backplane, HDI, multi-layer buried blind hole, thick copper plate, thick copper for power supply, semiconductor test plate |
| Stacking mode | Multiple pressing blind buried orifice plate | Same surface pressing ≤ 3 |
| HDI board type | 1 n 1, 1 1 n 1, 2 n 2, 3 n 3 (embedded hole in n ≤ 0.3mm), laser blind hole can be electroplated | |
| Local mixed pressure | Minimum distance from mechanical drilling to conductor in local mixed pressure area | ≤ 10 layers: 14mil; 12th floor: 15 mil; ＞ 12th floor: 18mil |
| Minimum distance from local mixed pressure junction to borehole | ≤ 12 layers: 12 mil; ＞ 12th floor: 15ml | |
| Surface treatment | unleaded | Copper nickel gold plating, gold plating, hard gold plating (with/without nickel), gold finger plating, lead-free tin spraying, OSP, chemical nickel palladium gold plating, soft gold plating (with/without nickel), silver plating, tin plating, ENIG OSP, ENIG G/F, full plate gold plating G/F, silver plating G/F, tin plating G/F |
| Lead | Tin spraying with lead | |
| Thickness diameter ratio | 10: 1 (lead/lead-free tin spraying, chemical nickel gold precipitation, silver precipitation, tin precipitation, chemical nickel palladium gold precipitation); 8：1（OSP） | |
| Machining dimension (MAX) | Gold deposition: 520 * 800mm, vertical tin deposition: 500 * 600mm, horizontal tin deposition: less than 500mm on one side; Horizontal silver deposition: less than 500mm on one side; Lead/lead-free tin spraying: 520 * 650mm; OSP: less than 500mm on one side; Hard gold electroplating: 450 * 500mm; One side is not allowed to exceed 520mm | |
| Machining dimension (MIN) | Tin deposition: 60 * 80mm; Silver deposit: 60 * 80mm; Lead/lead-free tin spraying: 150 * 230mm; OSP：60*80mm； At the surface of the walking plate smaller than the above size | |
| Processing plate thickness | Gold deposition: 0.2-7.0mm, tin deposition: 0.3-7.0mm (vertical tin deposition line), 0.3-3.0mm (horizontal line); Sediment silver: 0.3-3.0mm; Lead/lead-free tin spraying: 0.6-3.5mm; Solder spraying plate below 0.4mm shall be reviewed and manufactured; OSP：0.3-3.0mm； Hard gold electroplating: 0.3-5.0mm (plate thickness ratio 10:1) | |
| Minimum IC spacing of gold plate or minimum PAD to line spacing | 3mil | |
| Maximum height of golden finger | 1.5inch | |
| Minimum spacing between golden fingers | 6mil | |
| Minimum segment spacing of segmented golden finger | 7.5mil | |
| Surface coating thickness | Tin spraying | 2-40um (the thinnest thickness of lead tin sprayed big tin surface is 0.4um, and the thinnest thickness of lead-free tin sprayed big tin surface is 1.5um) |
| OSP | Film thickness: 0.2-0.4um | |
| Electroless nickel gold precipitation | Nickel thickness: 3-5 um; Gold thickness: 1-3uinch, ≥ 3uinch needs to be reviewed | |
| Chemical silver precipitation | 6-12uinch | |
| Chemical tin deposition | Tin thickness ≥ 1um | |
| Hard gold electroplating | 2-50uinch | |
| Electroplating soft gold | Gold thickness 0.10-1.5um (dry film coating process), gold thickness 0.10-4.0um (non dry film coating process) | |
| Chemical nickel palladium | NI:3-5um，Pd：1-6uinch，Au：1-4uinch | |
| Copper nickel gold electroplating | Gold thickness 0.025-0.10um, nickel thickness ≥ 3um, maximum thickness of base copper 1OZ | |
| Gold finger nickel plated gold | Gold thickness 1-50 uinch (the required value refers to the thinnest point), nickel thickness ≥ 3 um | |
| Carbon oil | 10-50 μ m | |
| Green oil | Copper cover oil (10-18um), through hole cover oil (5-8um), line corner ≥ 5um (one-time printing, copper thickness less than 48um) | |
| Blue gum | 0.20-0.80mm | |
| Drill hole | 0.1/0.15/0.2mm maximum plate thickness of mechanical drilling | 0.8mm/1.5mm/2.5mm |
| Minimum laser drilling aperture | 0.1mm | |
| Maximum laser drilling aperture | 0.15mm | |
| Mechanical hole diameter (finished product) | 0.10-6.2mm (corresponding to drill tool 0.15-6.3mm) | |
| The minimum finished aperture of PTFE material (including mixed pressure) plate is 0.25mm (corresponding to 0.35mm of drilling tool) | ||
| Aperture of mechanical buried blind hole ≤ 0.3mm (corresponding drill tool 0.4mm) | ||
| The diameter of the green oil plug hole in the middle of the pan is ≤ 0.45mm (corresponding to 0.55mm of the drilling tool) | ||
| Minimum hole diameter of connected hole is 0.35mm (corresponding to 0.45mm of drilling tool) | ||
| The minimum diameter of the metallized half hole is 0.30mm (corresponding to the drilling tool 0.4mm) | ||
| Maximum thickness diameter ratio of through-hole plate | 20: 1 (excluding tool diameter ≤ 0.2mm; ＞ 12:1 to be evaluated) | |
| Maximum depth to aperture ratio of laser drilling | 1：1 | |
| Maximum depth to aperture ratio of blind hole in mechanical depth control drilling | 1.3:1 (aperture ≤ 0.20mm), 1.15:1 (aperture ≥ 0.25mm) | |
| Minimum depth of mechanical depth control drill (back drill) | 0.2mm | |
| Drilling - Minimum distance from mechanical drilling to conductor (non buried blind hole plate and first order laser blind hole) | 5.5 mil (≤ 8 layers); 6.5mil（10-14）； 7mil (＞ 14 layers) | |
| Drilling - Minimum distance from mechanical drilling to conductor (mechanical buried blind hole plate and second-order laser buried blind hole) | 7mil (one press); 8mil (secondary pressing); 9 mil (three times pressing) | |
| Drilling - Minimum distance from mechanical drilling to conductor (laser blind hole) | 7mil（1 N 1）； 8mil (1 1 N 1 or 2 N 2) | |
| Drilling - minimum distance from laser drilling to conductor (1st and 2nd order HDI boards) | 5mil | |
| Drilling - Minimum distance between different network hole walls (after compensation) | 10mil | |
| Minimum distance between hole walls of the same network (after compensation) | 6mil (through hole; laser blind hole); 10mil (mechanical blind hole) | |
| Minimum distance between drilling hole and non-metallic hole wall (after compensation) | 8mil | |
| Bore hole location tolerance (compared with CAD data) | ±2mil | |
| Borehole - NPTH hole diameter tolerance minimum | ±2mil | |
| Drilling hole diameter accuracy of solderless devices | ±2mil | |
| Drilling - Tolerances on the depth of tapered holes | ±0.15mm | |
| Drilled - Tapered hole orifice diameter tolerance | ±0.15mm | |
| Pad | Minimum size of inner and outer pads of laser hole | 10mil (4mil laser hole), 11mil (5mil laser hole) |
| Minimum size of inner and outer pads of mechanical vias | 16mil (8mil aperture) | |
| BGA pad diameter min | Lead tin spraying process 10mil, lead-free tin spraying process 12mil, other processes 7mil | |
| Pad tolerance (BGA) | /-1.2mil (pad ＜ 12mil)/- 10% (pad ≥ 12mil) | |
| Lineweight/Spacing | Limit line width corresponding to copper thickness | |
| 1/2OZ：3/3mil | ||
| 1OZ: 3/4mil | ||
| 2OZ: 5/5mil | ||
| 3OZ: 7/7mil | ||
| 4OZ: 12/12mil | ||
| 5OZ: 16/16mil | ||
| 6OZ: 20/20mil | ||
| 7OZ: 24/24mil | ||
| 8OZ: 28/28mil | ||
| 9OZ: 30/30mil | ||
| 10OZ: 32/30mil | ||
| Line width tolerance | ≤10mil： /-1.0mil | |
| ＞10mil： /-1.5mil | ||
| Solder mask character | Maximum drilling diameter of resistance welding plug hole (cover oil on both sides | 0.5mm |
| Color of solder mask ink | Green, yellow, black, blue, red, white, purple, matte green, matte black, high refraction white oil | |
| Character ink color | White, yellow, black | |
| Maximum diameter of blue glue aluminum sheet plug hole | 5mm | |
| Bore diameter range of resin plug hole | 0.1-1.0mm | |
| Maximum thickness diameter ratio of resin plug hole | 12：1 | |
| Minimum width of resistance welding bridge | Special requirements for green oil 4mil and mottled 6mil control resistance welding bridge | |
| Minimum character line width | White characters 3mil high 24mil; Black character 5mil, 32mil high | |
| Minimum spacing of hollow characters | Hollow out width 8mil, height 40ml | |
| Hollow words of solder mask | Hollow out width 8mil, height 40ml | |
| Appearance | Distance from V-CUT copper free centerline to figure | H ≤ 1.0mm: 0.3mm (20 ° refers to V-CUT angle), 0.33mm (30 °), 0.37mm (45 °); |
| 1.0＜H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); | ||
| 1.6＜H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); | ||
| 2.4＜H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°); | ||
| V-CUT symmetry tolerance | ±4mil | |
| Maximum number of V-CUT lines | 100 | |
| V-CUT angle tolerance | ± 5 degrees | |
| V-CUT angle specification | 20. 30, 45 degrees | |
| Chamfer angle of golden finger | 20. 30, 45 degrees | |
| Chamfer angle tolerance of gold finger | ± 5 degrees | |
| Minimum distance of TAB beside golden finger without falling injury | 6mm | |
| Minimum distance between the side of golden finger and the contour edge line | 8mil | |
| Depth precision (NPTH) of controlled depth milling groove (edge) | ±0.10mm | |
| Boundary dimension accuracy (edge to edge) | ±8mil | |
| Minimum tolerance of milled slot hole (PTH) | Groove width and groove length are ± 0.15mm | |
| Minimum tolerance of milled slot hole (NPTH) | Groove width and groove length are ± 0.10mm | |
| Minimum tolerance of drilling slot hole (PTH) | Groove width direction ± 0.075mm; Slot length/width<2: slot length direction/-0.1mm; Slot length/slot width ≥ 2: slot length direction/-0.075mm | |
| Minimum tolerance of drilled slot hole (NPTH) | Groove width direction ± 0.05mm; Slot length/width<2: slot length direction/-0.075mm; Slot length/slot width ≥ 2: slot length direction/-0.05mm |
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